Product
CM Series Precision Optical Chamfering Machine
A semi-automatic precision chamfering system for optical cold processing, available in CM01, CM02, and CM03 models for flat, round, and other optical shapes. Compatible with most optical materials: glass, K9, BK7, fused silica, LBO, BBO, YAG, ZnSe, single-crystal silicon, YVO4, CaCO3, CaF2, sapphire, and more. Easy operation, high consistency, and precise, adjustable chamfer depth control. Eliminates dependence on skilled operators—ushering in a “foolproof” chamfering solution. Delivers highly uniform and consistent chamfered edges, perfectly suited for modern automated assembly.
Key Performance Metrics
- The CM series chamfering machines feature simple operation, high efficiency, rapid processing speed, and cost-effective labor savings.
- The CM series chamfering machines feature high chamfering accuracy and superior overall chamfering performance.
- Facilitates precise pre-chamfering of optical components prior to polishing, thereby aiding in quality control during the polishing process.
- The chamfering dimensions of long-length parts are uniform, with minimal differences between large and small ends, and exhibit strong consistency across different specimens.
- The grinding linear speed is adjustable (0–1200 m/min), with an LED digital display for intuitive visualization.
- The chamfer depth is continuously adjustable (0–0.8 mm), with an LED digital display for intuitive visualization.
- Spraying the “Tiefu Long” coating onto chamfered platforms can effectively protect the surface finish of optical components.
- Equipped with a calibration function that can correct the displayed chamfer amount based on actual measured values.
- Suitable for protective chamfers, marking chamfers, and pre-chamfering before polishing for optical components of various shapes and materials.
- Completely eliminates the reliance on skilled operators for determining the chamfer height of optical components.
Product Applications
Application Area
FPC, PCB: blind holes, through-holes
FPC and PCB cutting and routing
Solar Cell Scribing
Silicon wafer drilling
Wafer etching, marking, and cutting