Product
PanDo Q Series 355nm Ultraviolet Laser
Featuring three-mirror folded cavity, A-O Q-switching, side-pumped YAG, and LBO frequency doubling/summing, this series offers high energy density and robust reliability. Applications include solar cell processing, micro-drilling, FPC processing, semiconductor dicing, microelectronics, photochemistry, photobiology, and medical uses—especially high-temp material cutting (polyimide, ceramics, thin-film solar cells, wafer dicing). Side-pumped YAG and self-stabilized intracavity frequency doubling/summing enable high pulse energy and stable long-term output. The unique side-pump suspension and water-cooled thermal management ensure optical stability, guaranteeing consistent micro-machining quality. Available in multiple models with varied repetition rates and powers to suit diverse applications, delivering excellent value for money.
Key Performance Metrics
- The Q-series ultraviolet lasers offer the highest effective pulse energy and peak power.
- The unique intracavity frequency doubler crystal’s matching angle control ensures stable and superior energy output performance.
- The Q-series ultraviolet lasers offer a wide range of pulse energy and repetition rates to meet the requirements for cutting a broad spectrum of materials.
- The intracavity frequency doubling crystals and key components are exposed to UV radiation at minimal levels, thereby extending the laser’s lifespan.
- Excellent beam quality (M² <1.2), beam spot roundness, and beam directionality
- The industrial-integrated cavity component features an integrated structure with isolated IR cavity and UV cavity; all components undergo stress-relief treatment.
- Equipped with an RS232 control interface (programmable instruction set) that supports both internal and external pulse signal triggering.
- The distinction between the high-power Q30X series and the low-power Q33X series enables adaptation to the requirements of different application tiers.
- Customers can choose between 355 nm and 532 nm laser outputs.
Product Applications
Application Area
FPC, PCB: blind holes, through-holes
FPC and PCB cutting and routing
Solar Cell Scribing
Silicon wafer drilling
Wafer etching, marking, and cutting
Silicon wafer cutting and etching
30 μm body grating etched lines
ITO Electrode Pattern Design
Glass and ceramic engraving and cutting
Engraving on both the interior and exterior surfaces of glass
Production Tests
Vibration
Temp/ Humidity Cycle
Final test
Temperature Cycle
Life test
Stability Running